Danutek is proud to announce new partnership with PDR from UK, experts in IR Rework Stations.

The PDR IR Rework Stations are high-powered SMD/BGA rework stations heating with IR, both top and bottom. Using PDR’s Focused IR component heating, with powerful Quartz IR PCB preheaters, they are designed to rework all SMDs / BGAs on small to extra-large PCB assemblies.

Danutek started a partnership with Canada-based manufacturing software solutions provider, Cogiscan. Cogiscan’s TTC Platform provides our clients with a modular and scalable suite of products to help users achieve a tailored smart factory ecosystem. Our offerings are comprised of five key families: Connectivity, Data Management, Material and Process Control, Traceability, and Analytics.

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Danutek Hungary is proud to announce that the management system of the company has been certified according to the standards of both ISO 9001:2015 and ISO 27001:2013.

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Danutek and Sunmenta signed cooperation agreement to provide solution for high precision, automized stencil inspection.
The Nepcon China VISION awarded systems are ensure the perfect condition stencil usage every production days and now available in our regions like Hungary, Serbia and Slovenia.

For more information contact us: sales@danutek.com

Danutek glad to announce that we have new manufacturer partner to support our customers on the depaneling area.
We recently started our partnership with LPKF, leading manufacturer on Laser Depaneling of Rigid, Rigid-Flex and Flex PCB‘s.

For more information contact us: sales@danutek.com

Danutek has become the new official distributor of Pink GmbH Vacuum Soldering machinery in Hungary, Serbia and Ukraine.

If you wish to know more about Vacuum Soldering Technology, please click on the button below.

Danutek Hungary is exhibiting in the upcoming INTRONIKA exhibition and conference in Slovenia, Ljubljana on February 11 – 13, 2020. We hope to see you at our booth C106!
For more information, contact us.

It is widely recognized that over 70 percent of soldering defects are associated with the solder paste printing process.

These defects pose serious concerns to the industry, especially with the component miniaturization trend and the 0201M microchip emergence.