It is widely recognized that over 70 percent of soldering defects are associated with the solder paste printing process. These defects pose serious concerns to the industry, especially with the component miniaturization trend and the 0201M microchip emergence. Manufacturers cannot scrap the board and the microchip, due to procurement challenges and component costs. However, if the manufacturer does not repair the issue quickly, the whole board is susceptible to failure. Leading inspection supplier, Koh Young Technology is working diligently to extend the “Golden Hour” well beyond its limit by implementing new innovations like integrated tools to repair defective solder depositions.